SLA6806M and SLA6816MZ
High Voltage 3-Phase Motor Drivers
Features and Benefits
Description
▪ Built-in pre-drive IC
▪ IGBT power element
▪ CMOS compatible input (3.3 to 5 V)
▪ High-side gate driver using bootstrap circuit or floating
power supply
▪ Integrated Fast Recovery Diode (FRD) as freewheeling
diode for each IGBT
▪ Built-in protection circuit for controlling power supply
voltage drop on VCC and VB (UVLO)
▪ Overcurrent protection circuit (OCP)
▪ OCP holding time configurable with RCIN pin
▪ Output of fault signal during operation of protection circuit
▪ Output current 3 A and 5 A
▪ Small SIP (SLA 23-pin)
The SLA6806M and SLA6816MZ inverter power module
(IPM) devices provide a robust, highly-integrated solution for
optimally controlling 3-phase motor power inverter systems
and variable speed control systems used in energy-conserving
designs to drive motors of residential and commercial
appliances. These ICs take 230 VAC input voltage, and 3 A or
5 A (continuous) output current. They can withstand voltages
of up to 600 V (IGBT breakdown voltage).
The SLA6806M and SLA6816MZ power package includes
an IC with all of the necessary power elements (six IGBTs),
pre-driver ICs (two), and freewheeling diodes (six), needed
to configure the main circuit of an inverter. This enables the
main circuit of the inverter to be configured with fewer external
components than traditional designs.
Packages: Power SIP
Applications include residential white goods (home
applications) and commercial appliance motor control:
• Air conditioner fan
• Refrigerator compressor
• Dishwasher pump
Not to scale
Leadform
2152 (IEC)
Leadform
2151
Leadform 2153
Functional Block Diagram
VB1(2)
VB2(3)
VB3(4)
UVLO
UVLO
UVLO
VCC1(5)
UVLO
HIN1(9)
HIN2(8)
HIN3(7)
Input
Logic
High-Side
Level Shift Driver
VBB1(10)
VBB2(11)
HO1
HO2
HO3
COM1(6)
U(1)
V(13)
W1(12)
W2(14)
VCC2(23)
UVLO
LIN1(20)
LIN2(19)
LIN3(18)
LO1
Low-Side
Driver
LO2
LO3
Input Logic
(OCP reset)
COM2(21)
OCP
LS2(15)
OCP
FO(22)
RS
LS1(17)
RC (16)
Figure 1. Driver block diagrams.
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
Preliminary Data
Subject to Change Without Notice
January 16, 2013
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Selection Guide
Output Current
Part Number
IGBT Breakdown
Voltage, VCES(min)
(V)
IGBT Saturation
Voltage, VCE(sat)(typ)
(V)
Continuous, IO(max)
(A)
Pulsed, IOP (max)
(A)
SLA6806M
600
1.75
5
7.5
SLA6816MZ
600
1.75
3
4.5
Absolute Maximum Ratings, valid at TA = 25°C
Characteristic
IGBT Breakdown Voltage
Main Supply Voltage
Main Supply Voltage (Surge)
Symbol
Rating
Unit
VCES
VCC = 15 V, IC = 1 mA, VIN = 0 V
600
V
VBB
Between VBB and GND
400
V
VBB(surge)
Between VBB and GND
450
V
Between VCC and COM
20
V
20
V
Logic Supply Voltage
VCC
Bootstrap Voltage
VBS
Output Current, Continuous
IO
Output Current, Pulsed
IOP
Input Voltage
VIN
RC Pin Input Voltage
VRC
Allowable Power Dissipation
PD
Thermal Resistance (Junction to Case)
RθJC
Case Operating Temperature
TCOP
Remarks
Between VB and HS (U,V, and W phases)
SLA6806M
SLA6816MZ
SLA6806M
SLA6816MZ
TC = 25°C
PW ≤ 100 μs
SLA6816MZ
A
A
7.5
A
4.5
A
–0.5 to 7
V
Between RC and COM
SLA6806M
5
3
TC = 25°C, all elements operating
7
V
32.8
W
32.8
W
3.8
°C/W
5.4
°C/W
–20 to 100
°C
All elements operating (IGBT)
All elements operating (FRD)
Junction Temperature (MOSFET)
TJ
150
°C
Storage Temperature
Tstg
–40 to 150
°C
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
2
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Recommended Operating Conditions
Characteristic
Symbol
Remarks
Min.
Typ.
Max.
Units
–
–
400
V
13.5
–
16.5
V
33
–
390
kΩ
CC
1000
–
2200
pF
RB
22
–
220
Ω
μs
Main Supply Voltage
VBB
Between VBB and LS, IBB ≤ 2 A
Logic Supply Voltage
VCC
Between VCC and COM
Pull-Up Resistor (RC Input)
RC
Capacitor (RC Input)
Bootstrap Resistor
Minimum Input Pulse Width
PWM Carrier Frequency
Dead Time
28610.02, Rev. 4
tinmin(on)
On pulse
0.5
–
–
tinmin(off)
Off pulse
0.5
–
–
μs
fC
–
–
20
kHz
tdead
1.5
–
–
μs
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
3
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Typical Application Diagram
2
3
4
SLA6805MP
11
10
VB1
5
VB2
VB3
HO1
VCC1
HS1
1
HVIC
HO2
9
8
7
6
HS2
13
M
HIN1
HIN2
HIN3
HO3
COM1
HS3
12
14
23
VCC2
LO1
C o n t r o lle r
VRC
LVIC
RC
20
19
18
16
CC
22
21
LIN1
LO2
LIN2
RS
17
LIN3
LO3
RC
15
FO
COM2
RS
15V
NOTE:
▪ All of the input pins are connected to GND with internal pull-down resistors rated at 100 kΩ, however, an external pull-down
resistor may be required to secure stable condition of the inputs if high impedance conditions are applied to them.
▪ To use the OCP circuit, an external shunt resistor, RS, is needed. The RS value can be obtained from the formula:
RS(Ω) = 0.5 V / Overcurrent Detection Set Current (A) .
▪ A blanking timer is built-in to mask the noise generated on RS at turn-on.
▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from external
noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise susceptibility is
necessary.
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
4
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
ELECTRICAL CHARACTERISTICS, valid at TA = 25°C, unless otherwise noted
Characteristics
Logic Supply Voltage
Symbol
Conditions
Min
Typ
Max
Units
13.5
15
16.5
V
4
6
mA
140
400
μA
VCC
Between VCC and COM
Logic Supply Current
ICC
VCC = 15 V
–
Boot Supply Current
IBOOT
VB1 to U, VB2 to V, and VB3 to W = 15 V, HIN = 5 V per circuit
–
Input Voltage
Input Voltage Hysteresis
Input Current
VIH
VCC = 15 V, output on
–
2.0
2.5
V
VIL
VCC = 15 V, output off
1.0
1.5
–
V
VIhys
VCC = 15 V
–
0.5
–
V
IIH
High side, VCC = 15 V, VIN = 5 V
–
50
100
μA
IIL
Low side, VCC = 15 V, VIN = 0 V
VUVHL
VUVHH
Undervoltage Lock Out
VUVHhys
VUVLL
VUVLH
VUVLhys
FO Terminal Output Voltage
VFOL
VFOH
High side, between VB and U, V, or W
High side, hysteresis
Low side, between VB and U, V, or W
Low side, hysteresis
VCC = 15 V
–
–
2
μA
9.0
10.0
11.0
V
9.5
10.5
11.5
V
–
0.5
–
V
10.0
11.0
12.0
V
10.5
11.5
12.5
V
–
0.5
–
V
0
–
1.0
V
4.0
–
5.5
V
Overcurrent Protection Trip Voltage
VTRIP
VCC = 15 V
0.45
0.50
0.55
V
RC Threshold Voltage
VRCH
VCC = 15 V
3.1
–
3.85
V
μs
Overcurrent Protection Hold Time
tp
VRC = 5 V, RC = 330 kΩ, CC = 2200 pF
–
870
–
Blanking Time
tblank
VCC = 15 V
–
2
–
μs
IGBT Leakage Current
ICES
VCC = 15 V, VCE = 600 V, VIN = 0 V
–
–
1
mA
IGBT Saturation Voltage
VCE(sat)
Diode Forward Voltage
VF
28610.02, Rev. 4
SLA6806M
VCC = 15 V, IC = 5 A, VIN = 5 V
–
1.75
2.2
V
SLA6816MZ
VCC = 15 V, IC = 3 A, VIN = 5 V
–
1.75
2.1
V
SLA6806M
VCC = 15 V, IC = 5 A, VIN = 0 V
–
2.0
2.4
V
SLA6816MZ
VCC = 15 V, IF = 3 A, VIN = 0 V
–
1.65
2.0
V
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
5
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
SLA6806M ELECTRICAL CHARACTERISTICS, valid at TA = 25°C, unless otherwise noted
Characteristics
Symbol
Switching Time, High Side
Min
Typ
Max
Units
tdH(on)
–
510
–
ns
trH
–
80
–
ns
trrH
–
90
–
ns
tdH(off)
–
330
–
ns
tfH
tdL(on)
Switching Time, Low Side
Conditions
VBB = 300 V, VCC = 15 V, IC = 5 A, 0 V ≤ VIN ≤ 5 V,
inductive load
–
115
–
ns
–
500
–
ns
trL
–
110
–
ns
trrL
–
100
–
ns
tdL(off)
–
330
–
ns
tfL
–
115
–
ns
Min
Typ
Max
Units
tdH(on)
–
315
–
ns
trH
–
50
–
ns
trrH
–
80
–
ns
tdH(off)
–
375
–
ns
tfH
–
165
–
ns
SLA6016MZ ELECTRICAL CHARACTERISTICS, valid at TA = 25°C, unless otherwise noted
Characteristics
Symbol
Switching Time, High Side
tdL(on)
Switching Time, Low Side
Conditions
VBB = 300 V, VCC = 15 V, IC = 3 A, 0 V ≤ VIN ≤ 5 V,
inductive load
–
395
–
ns
trL
–
60
–
ns
trrL
–
75
–
ns
tdL(off)
–
395
–
ns
tfL
–
170
–
ns
IN
trr
ton
VDS
td(on)
tr
90%
ID
toff
td(off) tf
90%
10%
10%
Switching Characteristics Definitions
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
6
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Input-Output Truth Table
Mode
Normal1
OCP
VCCx UVLO2
VBx UVLO3
HINx
LINx
High-side
MOSFET
Low-side
MOSFET
L
L
Off
Off
H
L
On
Off
L
H
Off
On
H
H
On
On
L
L
Off
Off
H
L
On
Off
L
H
Off
Off
H
H
On
Off
Off
L
L
Off
H
L
Off
Off
L
H
Off
Off
H
H
Off
Off
L
L
Off
Off
H
L
Off
Off
L
H
Off
On
H
H
Off
On
1In
the case where a pair of HINx and LINx signals are asserted at the same time, a shoot-through
condition will occur. Software and hardware must be carefully designed to prevent this failure by setting
both the high-side and the low-side IGBTs off.
2After the VCCx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the highside IGBT (edge trigger). On the other hand, after the UVLO condition is released, the input level of the
LINx pins reflects the state of the low-side IGBTs (level trigger).
3After the VBx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the highside IGBT (edge trigger).
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
7
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
High Side Driver Input/Output Timing Diagrams
HIN
VUVHH
VB-HS
VUVHL
UVLO
Release
HO
After UVLO is released, IC operation is started by the first rising edge of input
Low Side Driver Input/Output Timing Diagrams
LIN
VCC
VUVHH
VUVHL
UVLO
Release
LO
tblank
VTRIP(H)
RS
tblank
VTRIP(L)
FO
tp = RC × CC × {–ln (1–3.5 / VRC)}
where CC ≤ 2200 pF
tp
RC
Slope by RC,CC
After UVLO is released, IC operation is started by the first rising edge of input
After RC charging and releasing, the OCP operation is started by the first rising edge of input
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
8
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Pin-out Diagrams
Leadform 2151
Pad Side
2
4
6
8
10
12
14
Leadform 2153
16
18
20
22
1
3
2
1
3
5
7
9
11
13
15
17
19
21
23
17
19
21
23
5
4
7
6
9
8
11
10
13
12
15
14
17
16
19
18
21
20
23
22
Leadform 2152
Pad Side
4
1
10
2
5
7
6
3
9
14
11 12
8
15
13
16
18
20
22
Pad Side
Terminal List Table
28610.02, Rev. 4
Number
1
Name
U
Function
2
VB1
High side bootstrap terminal (U phase)
3
VB2
High side bootstrap terminal (V phase)
4
VB3
High side bootstrap terminal (W phase)
Output of U phase
5
VCC1
High side logic supply voltage
6
COM1
High side logic GND terminal
7
HIN3
High side input terminal (W phase)
8
HIN2
High side input terminal (V phase)
9
HIN1
High side input terminal (U phase)
10
VBB1
Main supply voltage 1 (connect to VBB2 externally)
11
VBB2
Main supply voltage 2 (connect to VBB1 externally)
12
W1
13
V
Output of W phase (connect to W2 externally)
Output of V phase
14
W2
Output of W phase (connect to W1 externally)
15
LS2
Low side emitter terminal (connect to LS1 externally)
16
RC
Overcurrent protection hold time adjustment terminal
17
LS1
Low side emitter terminal (connect to LS1 externally)
18
LIN3
Low side input terminal (W phase)
19
LIN2
Low side input terminal (V phase)
20
LIN1
Low side input terminal (U phase)
21
COM2
22
FO
23
VCC2
Low side GND terminal
Overcurrent protection fault-signal output terminal
Low side logic supply voltage
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
9
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Package Outline Drawing
Leadform 2151
Dual rows, 23 alternating pins; vertical case mounting; pin #1 opposite pad side
Exposed
heatsink pad
31.3 ±0.2
31 ±0.2
24.4 ±0.2
16.4 ±0.2
4.8 ±0.2
0.6
Gate protrusion
1.7 ±0.1
Ø3.2 ±0.15
Ø3.2 ±0.15
2X Gate protrusion
2.45 ±0.2
BSC
16 ±0.2 B
12.9 ±0.2
9.9 ±0.2
Branding Area
2X Exposed
tie bar
5 ±0.5
9.3 +0.1
– 0.5
View A
1.27 ±0.5 A
0.65 +0.2
– 0.1
1
3
2
5
4
A
Measured at pin tips
B
To case top
7
6
9
8
11
10
13
12
15
14
17
16
19
18
21
20
R1
REF
+0.2
0.55 – 0.1
4.3
REF
4.5 ±0.7
23
22
Terminal core material: Cu
Terminal plating: Ni, with Pb-free solder coating
Recommended attachment: Solder dip (Sn-Ag-Cu)
0.7 MAX
0.7 MAX
Deflection at pin bend
View A
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, type: SLA6806M or SLA6816MZ
2nd line, lot:
YMDD
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
Leadframe plating Pb-free. Device composition
complies with the RoHS directive.
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
10
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Package Outline Drawing
Leadform 2152
Triple rows (IEC compliant), 23 alternating pins; vertical case mounting; pin #1 on pad side
Exposed
heatsink pad
31.3 ±0.2
31 ±0.2
24.4 ±0.2
16.4 ±0.2
4.8 ±0.2
0.6
Gate protrusion
1.7 ±0.1
Ø3.2 ±0.15
Ø3.2 ±0.15
2X Gate protrusion
2.45 ±0.2
BSC
16 ±0.2 B
12.9 ±0.2
9.9 ±0.2
Branding Area
2X Exposed
tie bar
5 ±0.5
8.7 +1
– 0.5
View A
1.27 ±0.5 A
0.6 +0.15
– 0.05
6
3
2
1
5
4
A
Measured at pin tips
B
To case top
8
7
16
13
11 12
9
10
15
18
17
20
19
R1
REF
0.5 +0.2
– 0.1
3.7
REF
3.1 ±0.7
3.1 ±0.7
22
21
23
14
Leadform: 2152
Terminal core material: Cu
Terminal plating: Ni
Recommended attachment: Solder dip (Sn-Ag-Cu)
0.7 MAX
0.7 MAX
Deflection at pin bend
View A
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, type: SLA6806M or SLA6816MZ
2nd line, lot:
YMDDT
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
T is the tracking letter
Leadframe plating Pb-free. Device composition
complies with the RoHS directive.
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
11
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Package Outline Drawing
Leadform 2153
Dual rows, 23 alternating pins; pins bent 90° for horizontal case mounting; pin #1 in outer row
Exposed
heatsink pad
31.3 ±0.2
31 ±0.2
24.4 ±0.2
16.4 ±0.2
4.8 ±0.2
0.6
Gate protrusion
1.7 ±0.1
Ø3.2 ±0.15
Ø3.2 ±0.15
2X Gate protrusion
2.45 ±0.2
BSC
16 ±0.2 B
12.9 ±0.2
3 ±0.5
BSC
9.9 ±0.2
Branding Area
2X Exposed
tie bar
2.2 ±0.7
BSC
R1
REF
4.4
REF
2.2 ±0.7
BSC
1.27 ±0.1 A
0.6 ±0.1
View A
0.5 ±0.1
1 2 3
5
7
9
11
13
15
17
19
21
23
16
4
6
18
8
12
14
20
10
22
0.7 MAX
0.7 MAX
Deflection at pin bend
View A
A
Measured at pin exit from case
B
To case top
Leadform: 2153
Terminal core material: Cu
Terminal plating: Ni
Recommended attachment: Solder dip (Sn-Ag-Cu)
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, type: SLA6806M or SLA6816MZ
2nd line, lot:
YMDDT
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
T is the tracking letter
Material Composition
Leadframe plating Pb-free.
Device composition complies
with the RoHS directive.
28610.02, Rev. 4
Description
Material
Specification
Lead Terminal
Cu
Ni plating, solder dip, or solder plating
Resin
Epoxy resin
Heatsink
Al
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
12
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
• Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
• Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials
SC102
Dow Corning Toray Silicone Co., Ltd.
28610.02, Rev. 4
Heatsink Mounting Method
Torque When Tightening Mounting Screws. The recommended tightening
torque for this product package type is: 58.8 to 78.4 N•cm (6.0 to
8.0 kgf•cm).
Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
380±5°C
•
5s
Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
•
When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
13
SLA6806M and
SLA6816MZ
High Voltage 3-Phase Motor Drivers
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
28610.02, Rev. 4
SANKEN ELECTRIC CO., LTD.
Preliminary Data
Subject to Change Without Notice
January 16, 2013
14
工商网监
湘ICP备2023018690号
